Home Industrial & Scientific Industrial Electrical Semiconductor Products Interfaces Communication Integrated Circuits400 Tie Point Interlocking Solderless Breadboard

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400 Tie Point Interlocking Solderless Breadboard

UGX 59,750

UGX 101,56041%

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+ shipping from UGX 18,158 to Central Business District

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Delivery Fees UGX 18,158

Ready for pickup between 13 December & 18 December when you order within next 16hrs 55mins

Door Delivery

Delivery Fees UGX 25,058

Ready for delivery between 13 December & 18 December when you order within next 16hrs 55mins

Return Policy

Free return within 7 days for eligible items.Details

Seller Information

Ibcoe Ksw

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Product details

Origin:Cn(origin)
Condition:New
Type:Logic ics
Application:Computer
Operating temperature:0-85
Supply voltage:3-5v
Dissipation power:1w
Package:Tqfp
Is_customized:Yes

Specifications

Key Features

Origin:Cn(origin)
Condition:New
Type:Logic ics
Application:Computer
Operating temperature:0-85
Supply voltage:3-5v
Dissipation power:1w
Package:Tqfp
Is_customized:Yes

What’s in the box

1*Integrated circuit

Specifications

SKU: GE779IP4R1OUGNAFAMZ
Model: Integrated circuit 2024
Production Country: China
Size (L x W x H cm): N/A
Weight (kg): 1
Color: Not Specified
Main Material: Plastic
From the Manufacturer: Prohibit high temperature exposure
Warranty Address: N/A
Warranty Type: Repair by Vendor

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