HomeHome & OfficeTools & Home ImprovementElectricalTools & HardwareBGA Reballing Stencil for S23 Ultra SM-S918U S918W S9180 S918D motherboard upper/lower layer Tin planting platform
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BGA Reballing Stencil for S23 Ultra SM-S918U S918W S9180 S918D motherboard upper/lower layer Tin planting platform

UGX 260,442
UGX 390,66333%

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+ shipping from UGX 52,275 to Central Business District
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Delivery Fees UGX 52,275
Ready for pickup between 13 January and 17 January if you place your order within the next 17hrs 26mins

Door Delivery

Delivery Fees UGX 59,175
Ready for delivery between 13 January and 17 January if you place your order within the next 17hrs 26mins

Return Policy

Free return within 7 days for eligible items.Details

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Katlynne

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Customer Rating: Excellent

Product details


BGA Reballing Stencil for S23 Ultra SM-S918U S918W S9180 S918D motherboard upper/lower layer Tin planting platform
  • I am an international seller
Our shop sells the most popular 3C consumer electronics products,such as mobile phone accessories,computer accessories,game peripherals,smart wearables,and follow the most popular fashion trends. If you like our products,please follow us,become our follower and fan.We will provide you with the most popular products to satisfy your fashion shopping experience.is_customized : NoSize : thickness 0.12mmPackage : BagModel Number : AMAOE S23 Ultra S918UApplication : Computer Tool KitDIY Supplies : ELECTRICALType : CombinationBrand Name : SAYTLOrigin : Mainland China

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Specifications

Key Features

is_customized : NoSize : thickness 0.12mmPackage : BagModel Number : AMAOE S23 Ultra S918UApplication : Computer Tool KitDIY Supplies : ELECTRICALType : CombinationBrand Name : SAYTLOrigin : Mainland China

  • 1.Our product is from cn(origin).
    • 2.high quality
      • 3.Quality Assurance
        • 4.YOUR SUPPORTIS OUR GREATEST MOTIVATIONPLEASE GIVE FIVE POINTS IF YOU ARE

What’s in the box

1x packages

Specifications

  • SKU: GE779IP1WVH8FNAFAMZ
  • Model: SM-SDCTGJ-6-23-2344
  • Production Country: China
  • Size (L x W x H cm): 20x10x20
  • Weight (kg): 0.4
  • Color: Red
  • Main Material: other

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BGA Reballing Stencil for S23 Ultra SM-S918U S918W S9180 S918D motherboard upper/lower layer Tin planting platform

BGA Reballing Stencil for S23 Ultra SM-S918U S918W S9180 S918D motherboard upper/lower layer Tin planting platform

UGX 260,442
UGX 390,66333%
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