HomeIndustrial & ScientificIndustrial ElectricalSemiconductor ProductsInterfacesCommunication Integrated Circuits0.3/0.35/0.4/0.5/ Parallel Hole Universal Multi Function Planting Tin Mesh Bga Reballing Black Steel Stencil Template
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0.3/0.35/0.4/0.5/ Parallel Hole Universal Multi Function Planting Tin Mesh Bga Reballing Black Steel Stencil Template

UGX 87,134
UGX 148,12441%

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+ shipping from UGX 22,813 to Central Business District
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Delivery Fees UGX 22,813
Ready for pickup between 05 December & 10 December when you order within next 16hrs 50mins

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Delivery Fees UGX 29,713
Ready for delivery between 05 December & 10 December when you order within next 16hrs 50mins

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Free return within 7 days for eligible items.Details

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Quality Score: Excellent

Product details

  • Origin:Cn(origin)
  • Condition:New
  • Type:Bga reballing stencil
  • Application:Mobile phone
  • Operating temperature:Bga reballing stencil
  • Supply voltage:Bga reballing stencil
  • Dissipation power:Bga reballing stencil
  • Package:d
  • Is_customized:Yes
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Specifications

Key Features

  • Origin:Cn(origin)
  • Condition:New
  • Type:Bga reballing stencil
  • Application:Mobile phone
  • Operating temperature:Bga reballing stencil
  • Supply voltage:Bga reballing stencil
  • Dissipation power:Bga reballing stencil
  • Package:d
  • Is_customized:Yes

What’s in the box

1*Integrated circuit

Specifications

  • SKU: GE779IP3ZXRZ2NAFAMZ
  • Model: Integrated circuit 2024
  • Production Country: China
  • Size (L x W x H cm): N/A
  • Weight (kg): 1
  • Color: 0.5-0.8 Universal
  • Main Material: Plastic
  • From the Manufacturer: Prohibit high temperature exposure
  • Care Label: wipe with a damp towel
  • Shop Type: Jumia Mall
  • Warranty Address: N/A
  • Warranty Type: Repair by Vendor

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0.3/0.35/0.4/0.5/ Parallel Hole Universal Multi Function Planting Tin Mesh Bga Reballing Black Steel Stencil Template

0.3/0.35/0.4/0.5/ Parallel Hole Universal Multi Function Planting Tin Mesh Bga Reballing Black Steel Stencil Template

UGX 87,134
UGX 148,12441%
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