HomeHome & OfficeTools & Home ImprovementWelding & SolderingSoldering & Brazing EquipmentParts & AccessoriesBrazing Kits4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template
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4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template

UGX 41,771
UGX 66,06437%

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+ shipping from UGX 11,001 to Central Business District
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Pickup Station

Delivery Fees UGX 11,001
Ready for pickup between 16 December & 20 December when you order within next 16hrs 42mins

Door Delivery

Delivery Fees UGX 13,001
Ready for delivery between 16 December & 20 December when you order within next 16hrs 42mins

Return Policy

Free return within 7 days for eligible items.Details

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Product details

100% Item new and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.

Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel

Package Contents:
4 x BGA Reballing Stencils

Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.

About Us
We provide the good product with the best price,we support Wholesale/Drop Shipping Order
1. For Drop Shipping order, please remark"dropshipping order", we will prioritize it.
2. For Wholesale/Drop Shipping orders, if you have any ideas about the price or package,please contact us in advance,we will give you the best service to satisfy your demands.

About Shipments
1.We will send out the orders ASAP once your payment is completed normally.
2.Please write your complete delivery address with correct phone number and zip code, especially please confirm your full name.

About After-sale Service
We are reliable seller and we have our professional after-sale service for all of our customs. If there is any question about the order,please contact us in advance ,we will always here until you get a happy answer.

About Feedback
1. Please check the package and item when you get carefully to make sure there is no problem.
2. If you have any problem or are not entirely satisfied with your package,please don’t be hesitate to contact us first before leaving negative feedback. We will resolve the problem to satisfy you.
3. If there is no problem, please leave us five star positive feedback.
Your affirmation is our greatest motivation ! !

Specifications

Key Features

  • BGA Stencil
  • for MTK MSM
  • BGA Direct Heat Template
  • BGA Stencil for MTK MSM
  • 4PCS Universal BGA Stencil

What’s in the box

4 x BGA Reballing Stencils

Specifications

  • SKU: GE779IP4VQY0NNAFAMZ
  • Model: BGA Stencil
  • Production Country: China
  • Size (L x W x H cm): 19.5x10x0.5
  • Weight (kg): 0.07
  • Main Material: stainless steel

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4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template

4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template

UGX 41,771
UGX 66,06437%
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