4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template

UGX 23,813

UGX 46,81449%

In stock

+ shipping from UGX 7,948 to Central Business District

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4PCS Universal BGA Stencil for MTK MSM Samsung Huawei Xiaomi iPad CPU RAM PM Power IC Reball Pin Direct Heat Template

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Delivery Fees UGX 7,948

Ready for pickup between 17 January and 22 January if you place your order within the next 14hrs 5mins

Door Delivery

Delivery Fees UGX 9,948

Ready for delivery between 17 January and 22 January if you place your order within the next 14hrs 5mins

Return Policy

Free return within 7 days for eligible items.Details

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Product details

100% brand new and high quality.
These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use.
High success rate of planting tin, the solder balls can be formed once when you are proficient.
Simple and convenient to use.

Item Type: BGA Reballing Stencil
Colour: silver
Material: stainless steel

Package Contents:
4 x BGA Reballing Stencils

Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.