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AMAOE BGA Reballing Stencil For iPhone13/13Pro/13Pro Max/13mini Motherboard middle layer IC Chip A15 CPU Direct heating template

UGX 49,098
UGX 66,10926%

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+ shipping from UGX 12,247 to Central Business District
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Delivery Fees UGX 12,247
Ready for pickup between 16 December & 20 December when you order within next 8hrs 35mins

Door Delivery

Delivery Fees UGX 14,247
Ready for delivery between 16 December & 20 December when you order within next 8hrs 35mins

Return Policy

Free return within 7 days for eligible items.Details

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Product details

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • Type: Combination
  • Application: Computer Tool Kit
  • Package: BAG
  • Model Number: BGA stencil for 13
  • Size: 0.12mm
  • is_customized: No
  • DIY Supplies: ELECTRICAL
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Specifications

Key Features

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • Type: Combination
  • Application: Computer Tool Kit
  • Package: BAG
  • Model Number: BGA stencil for 13
  • Size: 0.12mm
  • is_customized: No
  • DIY Supplies: ELECTRICAL

Specifications

  • SKU: GE779IP3PKCA1NAFAMZ
  • Production Country: China
  • Weight (kg): 0.5
  • Warranty Type: Repair by Vendor

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AMAOE BGA Reballing Stencil For iPhone13/13Pro/13Pro Max/13mini Motherboard middle layer IC Chip A15 CPU Direct heating template

AMAOE BGA Reballing Stencil For iPhone13/13Pro/13Pro Max/13mini Motherboard middle layer IC Chip A15 CPU Direct heating template

UGX 49,098
UGX 66,10926%
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