Home Automobile Car Electronics & Accessories Car Electronics Accessories Cell Phone Accessories Car KitsAmaoe Q888 Bga Stencil For Snapdragon 888 Sdm888 Cpu Ram Bottom Layer Upper Lower Chip Ic Solder Tin Net Steel Mesh-Q888

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Amaoe Q888 Bga Stencil For Snapdragon 888 Sdm888 Cpu Ram Bottom Layer Upper Lower Chip Ic Solder Tin Net Steel Mesh-Q888

UGX 55,100

UGX 74,48026%

In stock

+ shipping from UGX 11,967 to Central Business District

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Q888

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Pickup Station

Delivery Fees UGX 11,967

Ready for pickup between 15 March and 18 March if you place your order within the next 21hrs 42mins

Door Delivery

Delivery Fees UGX 13,467

Ready for delivery between 15 March and 18 March if you place your order within the next 21hrs 42mins

Return Policy

Free return within 7 days for eligible items.Details

Seller Information

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98%Seller Score

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Seller Performance

Shipping speed: Excellent

Quality Score: Excellent

Product details

Certification:NoneOrigin:Mainland

Specifications

Key Features

Welcome to our srore.
Type:Wrist Strap
Durable Material
Stylish Design
Versatile Usage
Great Value
Certification:None
Origin:Mainland

Specifications

SKU: GE779CA2SBY5TNAFAMZ
Production Country: China
Weight (kg): 0.5
Warranty Type: Repair by Vendor

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Amaoe Q888 Bga Stencil For Snapdragon 888 Sdm888 Cpu Ram Bottom Layer Upper Lower Chip Ic Solder Tin Net Steel Mesh-Q888

Amaoe Q888 Bga Stencil For Snapdragon 888 Sdm888 Cpu Ram Bottom Layer Upper Lower Chip Ic Solder Tin Net Steel Mesh-Q888

UGX 55,100

UGX 74,48026%

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