HomeAutomobileCar Electronics & AccessoriesCar Electronics AccessoriesCell Phone AccessoriesCar KitsAmaoe Q888 Bga Stencil For Snapdragon 888 Sdm888 Cpu Ram Bottom Layer Upper Lower Chip Ic Solder Tin Net Steel Mesh-Q888
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Amaoe Q888 Bga Stencil For Snapdragon 888 Sdm888 Cpu Ram Bottom Layer Upper Lower Chip Ic Solder Tin Net Steel Mesh-Q888

UGX 55,100
UGX 74,48026%

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+ shipping from UGX 11,267 to Central Business District
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Delivery Fees UGX 11,267
Ready for pickup between 20 February and 25 February if you place your order within the next 1hrs 8mins

Door Delivery

Delivery Fees UGX 13,267
Ready for delivery between 20 February and 25 February if you place your order within the next 1hrs 8mins

Return Policy

Free return within 7 days for eligible items.Details

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Shipping speed: Average

Product details

Certification:NoneOrigin:Mainland image image

Specifications

Key Features

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • Certification:None
  • Origin:Mainland

Specifications

  • SKU: GE779CA2SBY5TNAFAMZ
  • Production Country: China
  • Weight (kg): 0.5
  • Warranty Type: Repair by Vendor

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Amaoe Q888 Bga Stencil For Snapdragon 888 Sdm888 Cpu Ram Bottom Layer Upper Lower Chip Ic Solder Tin Net Steel Mesh-Q888

Amaoe Q888 Bga Stencil For Snapdragon 888 Sdm888 Cpu Ram Bottom Layer Upper Lower Chip Ic Solder Tin Net Steel Mesh-Q888

UGX 55,100
UGX 74,48026%
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