HomeAutomobileCar Electronics & AccessoriesCar Electronics AccessoriesCell Phone AccessoriesCar KitsAmaoe Q888 Bga Stencil For Snapdragon 888 Sdm888 Cpu Ram Bottom Layer Upper Lower Chip Ic Solder Tin Net Steel Mesh-Q888
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Amaoe Q888 Bga Stencil For Snapdragon 888 Sdm888 Cpu Ram Bottom Layer Upper Lower Chip Ic Solder Tin Net Steel Mesh-Q888

UGX 55,100
UGX 74,48026%

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+ shipping from UGX 2,600 to Central Business District
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Pickup Station

Delivery Fees UGX 2,600
Ready for pickup between 25 March and 26 March if you place your order within the next 23hrs 39mins

Door Delivery

Delivery Fees UGX 4,100
Ready for delivery between 25 March and 26 March if you place your order within the next 23hrs 39mins

Return Policy

Free return within 7 days for eligible items.Details

Seller Information

Oasis of Tranquility

78%Seller Score

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Seller Performance

Shipping speed: Average

Quality Score: Excellent

Product details

Certification:NoneOrigin:Mainland image image

Specifications

Key Features

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • Certification:None
  • Origin:Mainland

Specifications

  • SKU: GE779CA2SBY5TNAFAMZ
  • Production Country: China
  • Weight (kg): 0.5
  • Warranty Type: Repair by Vendor

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Amaoe Q888 Bga Stencil For Snapdragon 888 Sdm888 Cpu Ram Bottom Layer Upper Lower Chip Ic Solder Tin Net Steel Mesh-Q888

Amaoe Q888 Bga Stencil For Snapdragon 888 Sdm888 Cpu Ram Bottom Layer Upper Lower Chip Ic Solder Tin Net Steel Mesh-Q888

UGX 55,100
UGX 74,48026%
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