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BGA Reballing Stencil for Qualcomm Snapdragon 410/615/210/617/439 MSM8916 MSM8939 MSM8909 MSM8952 SDM439 Direct heating Template

UGX 41,366
UGX 55,67026%

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+ shipping from UGX 10,932 to Central Business District
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Delivery & Returns

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Pickup Station

Delivery Fees UGX 10,932
Ready for pickup between 28 January and 01 February if you place your order within the next 23hrs 1mins

Door Delivery

Delivery Fees UGX 12,932
Ready for delivery between 28 January and 01 February if you place your order within the next 23hrs 1mins

Return Policy

Free return within 7 days for eligible items.Details

Seller Information

Urban Gleam

60%Seller Score

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Seller Performance

Shipping speed: Poor

Quality Score: Excellent

Customer Rating: Poor

Product details

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • Type: Combination
  • Application: Computer Tool Kit
  • Package: BAG
  • Model Number: BGA Stencil for Qualcomm Snapdragon
  • Size: thickness 0.12mm
  • is_customized: No
  • DIY Supplies: ELECTRICAL
image

Specifications

Key Features

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • Type: Combination
  • Application: Computer Tool Kit
  • Package: BAG
  • Model Number: BGA Stencil for Qualcomm Snapdragon
  • Size: thickness 0.12mm
  • is_customized: No
  • DIY Supplies: ELECTRICAL

Specifications

  • SKU: GE779IP3SXZ25NAFAMZ
  • Production Country: China
  • Weight (kg): 0.5
  • Warranty Type: Repair by Vendor

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BGA Reballing Stencil for Qualcomm Snapdragon 410/615/210/617/439 MSM8916 MSM8939 MSM8909 MSM8952 SDM439 Direct heating Template

BGA Reballing Stencil for Qualcomm Snapdragon 410/615/210/617/439 MSM8916 MSM8939 MSM8909 MSM8952 SDM439 Direct heating Template

UGX 41,366
UGX 55,67026%
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