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HomeHome & OfficeTools & Home ImprovementPower & Hand ToolsPower Tool Parts & AccessoriesWoodworking Project Plans & KitsWoodworking Project KitsBGA Reballing Stencil for Qualcomm Snapdragon 835/820 MSM8998 MSM8996 Direct heating BGA Template
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Delivery & Returns
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Pickup Station
Delivery Fees UGX 9,632
Ready for pickup between 04 April and 07 April if you place your order within the next 4hrs 11mins
Door Delivery
Delivery Fees UGX 11,132
Ready for delivery between 04 April and 07 April if you place your order within the next 4hrs 11mins
Return Policy
Free return within 7 days for eligible items.Details
Seller Information
Urban Gleam
48%Seller Score
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Seller Performance
Shipping speed: Poor
Product details
- Welcome to our srore.
- Type:Wrist Strap
- Durable Material
- Stylish Design
- Versatile Usage
- Great Value
- Type: Combination
- Application: Computer Tool Kit
- Package: BAG
- Model Number: BGA Stencil for Qualcomm Snapdragon
- Size: thickness 0.12mm
- is_customized: No
- DIY Supplies: ELECTRICAL
Specifications
Key Features
- Welcome to our srore.
- Type:Wrist Strap
- Durable Material
- Stylish Design
- Versatile Usage
- Great Value
- Type: Combination
- Application: Computer Tool Kit
- Package: BAG
- Model Number: BGA Stencil for Qualcomm Snapdragon
- Size: thickness 0.12mm
- is_customized: No
- DIY Supplies: ELECTRICAL
Specifications
- SKU: GE779IP3SLFQXNAFAMZ
- Production Country: China
- Weight (kg): 0.5
- Warranty Type: Repair by Vendor
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/product/29/4279612/1.jpg?4674)
BGA Reballing Stencil for Qualcomm Snapdragon 835/820 MSM8998 MSM8996 Direct heating BGA Template
UGX 41,366
UGX 55,67026%
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