Chip Heat Insulation Pad IC Silicone Repair Pad Not

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Description:

【Material】: The phone repair pad is made of silicone material, is wear resistant and long service time【Size】:The IC silicone repair pad size is 12.5 cm x 12.5 cm/4.92 inch x 4.92 inch【Directly Replace】: Directly replace the old or broken chip heat insulation pad【Easy To Use】: The repair pad is easy to use and do not require complex steps to use【High Performance】: chip heat insulation pad high temperature resistance, non slip, not easily deformed, thickness of about 4.8mm

Specification:

Material: Silicone

Size Chart:

12.5 cm x 12.5 cm/4.92 inch x 4.92 inchThickness: 0.48cm/0.19inch

Package Includes:

1x Phone Repair Pad

Note:

Please allow slightly errors 1-2cm/0.39-0.79inch differences due to manual measurement.

Phone Repair Pad;Phone Repair Non Slip; Chip Heat Insulation Pad Portable;IC Silicone Repair Pad Wear Resistant;Accessory Professional Easy to Use;High Temperature Resistance Practical