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DIYPHONE Silver Planting Comprehensive BGA Reballing Stencil for 8 7 6 X 11 12 13 14 15 Pro Max XR XS CPU NAND Steel Mesh

UGX 34,021
UGX 46,00526%

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+ shipping from UGX 9,684 to Central Business District
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Pickup Station

Delivery Fees UGX 9,684
Ready for pickup between 25 January and 30 January if you place your order within the next 18hrs 15mins

Door Delivery

Delivery Fees UGX 11,684
Ready for delivery between 25 January and 30 January if you place your order within the next 18hrs 15mins

Return Policy

Free return within 7 days for eligible items.Details

Seller Information

Serene Emporium

74%Seller Score

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Seller Performance

Shipping speed: Average

Quality Score: Excellent

Customer Rating: Average

Product details

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • Type: Combination
  • Application: phone repair tool
  • Package: Case
  • Model Number: BGA Reballing Stencil
  • Size: 0.12mm
  • is_customized: No
  • DIY Supplies: ELECTRICAL
  • Item Name: AMAO BGA Reballing Stencil Template
  • Material: Stainless Steel
  • Function: for BGA IC Chips Repairing Tool
  • Suitable for: Power/USB Control IC Maintenance Engineer
  • Features 1: Support Extended Positioning Base
  • Advantage: Best BGA Repair Solution for Circuit Board
  • Support: for 6/6P 6S/6SP 7/7P 8 8P X,for 11 12 13 Pro Max
  • Features 2: High Precision, Not Easily Deformed
  • 100%:
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Specifications

Key Features

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • Type: Combination
  • Application: phone repair tool
  • Package: Case
  • Model Number: BGA Reballing Stencil
  • Size: 0.12mm
  • is_customized: No
  • DIY Supplies: ELECTRICAL
  • Item Name: AMAO BGA Reballing Stencil Template
  • Material: Stainless Steel
  • Function: for BGA IC Chips Repairing Tool
  • Suitable for: Power/USB Control IC Maintenance Engineer
  • Features 1: Support Extended Positioning Base
  • Advantage: Best BGA Repair Solution for Circuit Board
  • Support: for 6/6P 6S/6SP 7/7P 8 8P X,for 11 12 13 Pro Max
  • Features 2: High Precision, Not Easily Deformed
  • 100%:

Specifications

  • SKU: GE779IP3DY295NAFAMZ
  • Production Country: China
  • Weight (kg): 0.5
  • Warranty Type: Repair by Vendor

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DIYPHONE Silver Planting Comprehensive BGA Reballing Stencil for 8 7 6 X 11 12 13 14 15 Pro Max XR XS CPU NAND Steel Mesh

DIYPHONE Silver Planting Comprehensive BGA Reballing Stencil for 8 7 6 X 11 12 13 14 15 Pro Max XR XS CPU NAND Steel Mesh

UGX 34,021
UGX 46,00526%
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