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Ponycot
98%Seller Score
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Quality Score: Excellent
Gaming Mobile Phone Cooling Plate Heat Sink Semiconductor Refrigeration Area Amplifier For hone / Samsung / Huawei / Xiaomi
Product Specification
Product name: Composite uniform heat plate Product size: 60*106*28mm Product weight: 10g Color: Black Features: Light and thin Product category: Ordinary model (used with semiconductor heat diation back cl, the back is made of conductive silicon paper) ic suction model (for general purpose ic suction model and back cl , with double-sided tape on the back)
How to use
Attach to the back of the phone, with the use of heat sink, increase the heat diation area, to achieve the phone CPU and camera cooling. The ic absorbing product is embedded inside the ic sheet, seamlely d, the ic absorbing can be directly adsorbed to use.
Product Descrtion
[Mobile phone composite even heat plate] fast cooling uniform heat diation, increase the heat diation area, accelerate the speed of heat diation. [Semiconductor cooling & large area heat sink] for cell phone hot spots, using a large area even heat sink, rapid neutralization of heat to achieve uniform heat diation effect. [Strong adhesive - not fall off] strong adhesive, firmly adsorbed, no need to worry about fall. [Thin and light experience] The thickne is only 1mm, closely fit the phone. [With silicone protection, do not hurt the phone] easy to take and easy to , with silicone protection, soft and do not hurt the hine.
Package Included:
1* Heat sink area increase plate
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