HomePhones & TabletsMobile Phone AccessoriesChargersH15 Gaming Phone Cooler Silent Clamp - S3 semiconductor black + P2 heat dissipation average hot plate combination
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Shipped from abroad

H15 Gaming Phone Cooler Silent Clamp - S3 semiconductor black + P2 heat dissipation average hot plate combination

UGX 47,392
UGX 56,86317%

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+ shipping from UGX 9,957 to Central Business District
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Pickup Station

Delivery Fees UGX 9,957
Ready for pickup between 13 December & 18 December when you order within next 17hrs 18mins

Door Delivery

Delivery Fees UGX 11,057
Ready for delivery between 13 December & 18 December when you order within next 17hrs 18mins

Return Policy

Free return within 7 days for eligible items.Details

Seller Information

Alibaba_1688

60%Seller Score

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Product details

  • Durable Material:Made from durable materials, this heat sink is built to last, providing long-term service for your device.
  • Compact Design:Its compact design makes it easy to carry around, ensuring you can stay cool wherever you go.
  • Versatile Use:Whether youre gaming, streaming, or simply using your phone, this heat sink will help keep your device cool, enhancing your overall user experience.
  • Bulk Availability:Available for bulk , this heat sink is perfect for businesses looking to supply reliable and high-quality cooling solutions for their customers.
  • Silent Operation:This heat sink operates quietly, making it ideal for gaming or live streams without disturbing your audience.
  • Effective Heat Dissipation:The H15 mobile phone heat sink is designed to effectively dissipate heat, ensuring your device stays cool even during intensive gaming or video streaming.

Specifications

Key Features

H15 mobile phone radiator physical cooling chicken eating artifact game live broadcast back clip mute

Specifications

  • SKU: GE779EA4HC8OXNAFAMZ
  • Weight (kg): 0.50
  • Color: S3 semiconductor black + P2 heat dissipation average hot plate combination

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H15 Gaming Phone Cooler Silent Clamp - S3 semiconductor black + P2 heat dissipation average hot plate combination

H15 Gaming Phone Cooler Silent Clamp - S3 semiconductor black + P2 heat dissipation average hot plate combination

UGX 47,392
UGX 56,86317%
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