K23 Pro Phone Repair Fixture Mobile Phone Motherboard Fi

1.The product is made of double-layer synthe-tic material with high temperature res-istance, fast heat dissipation and no deformation.
2.Adopt new precision mold, double axis desi-gn, tight and not loose.
3.The card position adopts 3-level design, wh-ich can hold various mobile phone motherb-oards and IC directly for IC degumming and tin planting.
4.The double-layer base can rotate at multiple angles, especially suitable for use with micr-oscope.
5.Two mobile phone motherboards can be cl-amped at the same time, and the maximum can be used to clamp the main board of notebook

Colour:blue
Material:Stainless steel

Package Contents:
1 x Host

Only the above package content, other products are not included.
Note: Light reflection and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.