HomeHome & OfficeTools & Home ImprovementWelding & SolderingWelding EquipmentLead-free solder BGA Tin Beads 0.25-0.76 Balls 2.5W pcs Small Bottled Tin Balls Leadless SAC305-0.76mm_0.25mm
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Lead-free solder BGA Tin Beads 0.25-0.76 Balls 2.5W pcs Small Bottled Tin Balls Leadless SAC305-0.76mm_0.25mm

UGX 49,020 - UGX 110,200
UGX 66,120 - UGX 148,96026%

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Delivery Fees UGX 12,233
Ready for pickup between 27 November & 02 December when you order within next 6hrs 49mins

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Delivery Fees UGX 14,233
Ready for delivery between 27 November & 02 December when you order within next 6hrs 49mins

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Serengeti Soul Market

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Product details

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • Weight: 25W
  • Melting Point: 227
  • Diameter: 0.2-0.76
  • Model Number: SAC305
  • Material: SAC305
  • Certification: RoHS
  • Article number: QW25
  • purpose: BGA CPU planting
  • model: SAC 305 25W PCS
  • area of application: BGA CPU planting
  • melting point: 183
  • series: Tin bead series
  • texture of wood: SN/AG/CU
  • Wire diameter: 0.2-0.76
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Specifications

Key Features

  • Welcome to our srore.
  • Type:Wrist Strap
  • Durable Material
  • Stylish Design
  • Versatile Usage
  • Great Value
  • Weight: 25W
  • Melting Point: 227
  • Diameter: 0.2-0.76
  • Model Number: SAC305
  • Material: SAC305
  • Certification: RoHS
  • Article number: QW25
  • purpose: BGA CPU planting
  • model: SAC 305 25W PCS
  • area of application: BGA CPU planting
  • melting point: 183
  • series: Tin bead series
  • texture of wood: SN/AG/CU
  • Wire diameter: 0.2-0.76

Specifications

  • SKU: GE779IP4N7AJMNAFAMZ
  • Production Country: China
  • Weight (kg): 0.5
  • Warranty Type: Repair by Vendor

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Lead-free solder BGA Tin Beads 0.25-0.76 Balls 2.5W pcs Small Bottled Tin Balls Leadless SAC305-0.76mm_0.25mm

Lead-free solder BGA Tin Beads 0.25-0.76 Balls 2.5W pcs Small Bottled Tin Balls Leadless SAC305-0.76mm_0.25mm

UGX 49,020 - UGX 110,200
UGX 66,120 - UGX 148,96026%
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