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Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor

UGX 139,745
UGX 199,66330%

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+ shipping from UGX 25,657 to Central Business District
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Pickup Station

Delivery Fees UGX 25,657
Ready for pickup between 28 January and 01 February if you place your order within the next 8hrs 38mins

Door Delivery

Delivery Fees UGX 26,757
Ready for delivery between 28 January and 01 February if you place your order within the next 8hrs 38mins

Return Policy

Free return within 7 days for eligible items.Details

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Product details

Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
1. Strong magnetic automatic positioning function, built-in strong magnetic adsorption, precise alignment without offset.
2. Leakage tin barrier design, equipped with a leak-proof tin tin plate, and the mobile phone motherboard is protected from damage.
3. Special grade steel mesh material, high temperature resistance of 500 degrees Celsius, no bulging, no deformation.
4. Intelligent value tin, powerful functions are integrated, easy to operate.
5. Suitable for iPhone X / XS / XS Max / 11 / 11 Pro / 11 Pro Max


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Specifications

Key Features

  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor

Specifications

  • SKU: GE779EA3Z627ZNAFAMZ
  • Weight (kg): 0.20

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Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor

Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor

UGX 139,745
UGX 199,66330%
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