HomePhones & TabletsMobile Phone AccessoriesReplacement Parts & ToolsMechanic IBGA Max Mid-level Positioning Planting Tin Platfor
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Mechanic IBGA Max Mid-level Positioning Planting Tin Platfor

UGX 146,480
UGX 209,25730%

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+ shipping from UGX 26,802 to Central Business District
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Pickup Station

Delivery Fees UGX 26,802
Ready for pickup between 11 December & 16 December when you order within next 8hrs 7mins

Door Delivery

Delivery Fees UGX 27,902
Ready for delivery between 11 December & 16 December when you order within next 8hrs 7mins

Return Policy

Free return within 7 days for eligible items.Details

Seller Information

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Product details

Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
1. Strong magnetic automatic positioning function, built-in strong magnetic adsorption, precise alignment without offset.
2. Leakage tin barrier design, equipped with a leak-proof tin tin plate, and the mobile phone motherboard is protected from damage.
3. Special grade steel mesh material, high temperature resistance of 500 degrees Celsius, no bulging, no deformation.
4. Intelligent value tin, powerful functions are integrated, easy to operate.
5. Suitable for iPhone X / XS / XS Max / 11 / 11 Pro / 11 Pro Max


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Specifications

Key Features

  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor

What’s in the box

1 x package

Specifications

  • SKU: GE779EA4WJTKTNAFAMZ
  • Model: B18772IFR=SPT0607
  • Production Country: China
  • Size (L x W x H cm): 12 x 8 x 2cm
  • Weight (kg): 0.20
  • Color: Multicolor
  • Main Material: Multi-Material

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Mechanic IBGA Max Mid-level Positioning Planting Tin Platfor

Mechanic IBGA Max Mid-level Positioning Planting Tin Platfor

UGX 146,480
UGX 209,25730%
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