HomePhones & TabletsMobile Phone AccessoriesReplacement Parts & ToolsMechanic IBGA Max Mid-level Positioning Planting Tin Platfor
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Mechanic IBGA Max Mid-level Positioning Planting Tin Platfor

UGX 146,480
UGX 209,25730%

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Delivery Fees UGX 27,102
Ready for pickup between 04 April and 07 April if you place your order within the next 10hrs 3mins

Door Delivery

Delivery Fees UGX 28,202
Ready for delivery between 04 April and 07 April if you place your order within the next 10hrs 3mins

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Free return within 7 days for eligible items.Details

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Product details

Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
1. Strong magnetic automatic positioning function, built-in strong magnetic adsorption, precise alignment without offset.
2. Leakage tin barrier design, equipped with a leak-proof tin tin plate, and the mobile phone motherboard is protected from damage.
3. Special grade steel mesh material, high temperature resistance of 500 degrees Celsius, no bulging, no deformation.
4. Intelligent value tin, powerful functions are integrated, easy to operate.
5. Suitable for iPhone X / XS / XS Max / 11 / 11 Pro / 11 Pro Max


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Specifications

Key Features

  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor
  • Mechanic iBGA Max Mid-level Positioning Planting Tin Platfor

What’s in the box

1 x package

Specifications

  • SKU: GE779EA47A8J5NAFAMZ
  • Model: B19061DW0=SPT0607
  • Production Country: China
  • Size (L x W x H cm): 12 x 8 x 2cm
  • Weight (kg): 0.20
  • Color: Multicolor
  • Main Material: Multi-Material

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Mechanic IBGA Max Mid-level Positioning Planting Tin Platfor

Mechanic IBGA Max Mid-level Positioning Planting Tin Platfor

UGX 146,480
UGX 209,25730%
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