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HomeHome & OfficeTools & Home ImprovementPower & Hand ToolsPower Tool Parts & AccessoriesWoodworking Project Plans & KitsWoodworking Project KitsMijing Z21 MAX CPU BGA Reballing Stencil Platform For A8-A17 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template-Z21 MAX for iPhone_GOLD
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Mijing Z21 MAX CPU BGA Reballing Stencil Platform For A8-A17 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template-Z21 MAX for iPhone_GOLD
UGX 142,500
UGX 192,28026%
In stock
+ shipping from UGX 28,125 to Central Business District
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Pickup Station
Delivery Fees UGX 28,125
Ready for pickup between 21 November & 26 November when you order within next 23hrs 52mins
Door Delivery
Delivery Fees UGX 30,125
Ready for delivery between 21 November & 26 November when you order within next 23hrs 52mins
Return Policy
Free return within 7 days for eligible items.Details
Seller Information
African Safari Treasures
74%Seller Score
1 Followers
Seller Performance
Shipping speed: Average
Quality Score: Excellent
Customer Rating: Average
Product details
- Welcome to our srore.
- Type:Wrist Strap
- Durable Material
- Stylish Design
- Versatile Usage
- Great Value
- Type: Combination
- Application: Computer Tool Kit
- Package: Case
- Model Number: Mijing Z21 MAX
- Size: 55*55*15mm
- is_customized: YES
- DIY Supplies: ELECTRICAL
- Use: Chip tin planting suit
- Item: Z21 MAX Chip Tin Station
- Function: CPU BGA Reballing
- Function 2: BGA Tin Planting
- 100%: ,
Specifications
Key Features
- Welcome to our srore.
- Type:Wrist Strap
- Durable Material
- Stylish Design
- Versatile Usage
- Great Value
- Type: Combination
- Application: Computer Tool Kit
- Package: Case
- Model Number: Mijing Z21 MAX
- Size: 55*55*15mm
- is_customized: YES
- DIY Supplies: ELECTRICAL
- Use: Chip tin planting suit
- Item: Z21 MAX Chip Tin Station
- Function: CPU BGA Reballing
- Function 2: BGA Tin Planting
- 100%: ,
Specifications
- SKU: GE779IP3O5HH4NAFAMZ
- Production Country: China
- Weight (kg): 0.5
- Warranty Type: Repair by Vendor
Customer Feedback
This product has no ratings yet.
/product/21/9652402/1.jpg?5152)
Mijing Z21 MAX CPU BGA Reballing Stencil Platform For A8-A17 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template-Z21 MAX for iPhone_GOLD
UGX 142,500
UGX 192,28026%
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