This website uses cookies
This website uses cookies. For further information on how we use cookies you can read our Privacy and Cookie notice
HomeHome & OfficeTools & Home ImprovementPower & Hand ToolsPower Tool Parts & AccessoriesWoodworking Project Plans & KitsWoodworking Project KitsMijing Z21 MAX CPU BGA Reballing Stencil Platform For A8-A17 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template-Z21 MAX for iPhone_GOLD
/product/21/9652402/1.jpg?5152)
/product/21/9652402/2.jpg?5152)
/product/21/9652402/3.jpg?5152)
/product/21/9652402/4.jpg?5152)
/product/21/9652402/5.jpg?5152)
/product/21/9652402/6.jpg?5152)
Share this product
Shipped from abroad
Mijing Z21 MAX CPU BGA Reballing Stencil Platform For A8-A17 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template-Z21 MAX for iPhone_GOLD
UGX 142,500
UGX 192,28026%
In stock
+ shipping from UGX 26,825 to Central Business District
0 out of 5
(No ratings available)Variation available
Promotions
Delivery & Returns
Shipped from abroad
Choose your location
Pickup Station
Delivery Fees UGX 26,825
Ready for pickup between 06 March and 08 March if you place your order within the next 12hrs 1mins
Door Delivery
Delivery Fees UGX 28,325
Ready for delivery between 06 March and 08 March if you place your order within the next 12hrs 1mins
Return Policy
Free return within 7 days for eligible items.Details
Seller Information
African Safari Treasures
80%Seller Score
1 Followers
Seller Performance
Quality Score: Excellent
Customer Rating: Average
Product details
- Welcome to our srore.
- Type:Wrist Strap
- Durable Material
- Stylish Design
- Versatile Usage
- Great Value
- Type: Combination
- Application: Computer Tool Kit
- Package: Case
- Model Number: Mijing Z21 MAX
- Size: 55*55*15mm
- is_customized: YES
- DIY Supplies: ELECTRICAL
- Use: Chip tin planting suit
- Item: Z21 MAX Chip Tin Station
- Function: CPU BGA Reballing
- Function 2: BGA Tin Planting
- 100%: ,
Specifications
Key Features
- Welcome to our srore.
- Type:Wrist Strap
- Durable Material
- Stylish Design
- Versatile Usage
- Great Value
- Type: Combination
- Application: Computer Tool Kit
- Package: Case
- Model Number: Mijing Z21 MAX
- Size: 55*55*15mm
- is_customized: YES
- DIY Supplies: ELECTRICAL
- Use: Chip tin planting suit
- Item: Z21 MAX Chip Tin Station
- Function: CPU BGA Reballing
- Function 2: BGA Tin Planting
- 100%: ,
Specifications
- SKU: GE779IP3O5HH4NAFAMZ
- Production Country: China
- Weight (kg): 0.5
- Warranty Type: Repair by Vendor
Customer Feedback
This product has no ratings yet.
/product/21/9652402/1.jpg?5152)
Mijing Z21 MAX CPU BGA Reballing Stencil Platform For A8-A17 Hisilicon Qualcomm Snapdragon IC Chip Planting Tin Template-Z21 MAX for iPhone_GOLD
UGX 142,500
UGX 192,28026%
Questions about this product?
