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Ponycot
98%Seller Score
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Quality Score: Excellent
Mobile Phone Cooler Cooling Fan Back Cl Game Heat Sink Cell Phone Coolers For hone/Samsung/Xiaomi Phone Acceories
Descrtion:
Product Specifications.
Product name: Composite uniform heat plate
Product size: 60*106*28mm
Product category: ordinary models (with semiconductor cooling back cl use, back material conductive silicon paper)
ic (universal ic models and back cl models heat sink use, the back of the material double-sided adhesive)
ic dual-use models (universal ic and back cl s, the upper and lower are made of water-washed glue, the middle is thermally conductive silicone grease, which increases thermal conductivity, and the external invisible ic ring enhances thermal conductivity and is beautiful, and can be used repeatedly)
How to use: Attach to the back of the phone, with the use of heat sink, increase the heat diation area, to achieve the phone CPU and camera cooling.
The ic absorbing product is embedded inside the ic sheet, seamlely d, the ic absorbing can be directly adsorbed to use.
Specifications:
[Mobile phone composite even heat plate] fast cooling uniform heat diation, increase the heat diation area, accelerate the speed of heat diation.
[Semiconductor cooling & large area heat sink] for cell phone hot spots, using a large area even heat sink, rapid neutralization of heat to achieve uniform heat diation effect.
[Strong adhesive - not fall off] strong adhesive, firmly adsorbed, no need to worry about fall.
[Thin and light experience] The thickne is only 1mm, closely fit the phone.
[With silicone protection, do not hurt the phone] easy to take and easy to , with silicone protection, soft and do not hurt the hine.
Package Included:
1×Heat sink area increase plate
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