Home Home & Office Office Products Office & School Supplies Binders & Binding SystemsMultifunction BGA Stencil 0.3/0.35/0.4/0.5/Parallel/45 Degree Hole Universal Solder Template BGA Reballing Stencil

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Multifunction BGA Stencil 0.3/0.35/0.4/0.5/Parallel/45 Degree Hole Universal Solder Template BGA Reballing Stencil

UGX 32,511

UGX 49,55834%

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+ shipping from UGX 7,727 to Central Business District

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Delivery Fees UGX 7,727

Ready for pickup between 05 April and 08 April if you place your order within the next 22mins

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Delivery Fees UGX 8,827

Ready for delivery between 05 April and 08 April if you place your order within the next 22mins

Return Policy

Free return within 7 days for eligible items.Details

Seller Information

ZhiJiangShiPengCunShangMaoYouXianGongSi

60%Seller Score

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Quality Score: Excellent

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Product details

Model Number: CPU BGA Reballing Stencil
Applicaiton:for Android Phone Repair
Thickness:0.12MM

Material:steel
colour:silver

Package Contents:
1 * BGA Stencil

Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.