Multifunction BGA Stencil 0.3/0.35/0.4/0.5/Parallel/45 Degree Hole Universal Solder Template BGA Reballing Stencil

UGX 15,048

UGX 30,09650%

6 units left

+ shipping from UGX 4,458 to Central Business District

0 out of 5

(No ratings available)

Promotions

Shop the New Year Sale & Save Upto 50% Off Double the Value: Buy 2 or More, Get 20% Off Check out brand new computing deals Now

Report incorrect product information

Delivery & Returns

Shipped from abroad

Choose your location

Pickup Station

Delivery Fees UGX 4,458

Ready for pickup between 22 January and 27 January if you place your order within the next 13hrs 29mins

Door Delivery

Delivery Fees UGX 6,458

Ready for delivery between 22 January and 27 January if you place your order within the next 13hrs 29mins

Return Policy

Free return within 7 days for eligible items.Details

Seller Information

adjustment

88%Seller Score

6 Followers

Seller Performance

Shipping speed: Good

Quality Score: Excellent

Customer Rating: Good

Product details

Model Number: CPU BGA Reballing Stencil
Applicaiton:for Android Phone Repair
Thickness:0.12MM

Material:steel
colour:silver

Package Contents:
1 * BGA Stencil

Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.