HomePhones & TabletsMobile Phone AccessoriesCar AccessoriesNew Magnetic Phone Cooling Semiconductor Heat Spreader - P2 mobile phone heat dissipation average hot plate Foundation (with magnetic ring + washable nano black glue)
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New Magnetic Phone Cooling Semiconductor Heat Spreader - P2 mobile phone heat dissipation average hot plate Foundation (with magnetic ring + washable nano black glue)

UGX 15,284
UGX 18,32517%

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+ shipping from UGX 4,498 to Central Business District
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Delivery Fees UGX 4,498
Ready for pickup between 11 December & 16 December when you order within next 15hrs 48mins

Door Delivery

Delivery Fees UGX 5,598
Ready for delivery between 11 December & 16 December when you order within next 15hrs 48mins

Return Policy

Free return within 7 days for eligible items.Details

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Product details

  • Half-Conductive Material:Made from half-conductive material, this heat sink provides efficient conduction of heat, contributing to its effective cooling performance.
  • Magnetic Design:The magnetic design of this heat sink allows for easy attachment to your device, ensuring it stays in place even during active use.
  • Versatile Use:Not only for mobile phones, this heat sink can also be used for other electronic devices, making it a versatile addition to your tech toolkit.
  • Easy Cleaning:The heat sink is easy to clean, simply rinse it with water after each use, maintaining its optimal performance.
  • Effective Cooling:Designed to effectively dissipate heat, this heat sink ensures your phone stays cool, reducing the risk of overheating and damage.
  • Reusable Heat Sink:This new heat sink for mobile phones is reusable, making it a cost-effective solution for keeping your device cool during use.

Specifications

Key Features

New mobile phone heat dissipation heat plate repeatable washable heat conduction sheet cooling artifact semiconductor magnetic refrigeration heat

Specifications

  • SKU: GE779EA4TKVMGNAFAMZ
  • Weight (kg): 0.0005

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New Magnetic Phone Cooling Semiconductor Heat Spreader - P2 mobile phone heat dissipation average hot plate Foundation (with magnetic ring + washable nano black glue)

New Magnetic Phone Cooling Semiconductor Heat Spreader - P2 mobile phone heat dissipation average hot plate Foundation (with magnetic ring + washable nano black glue)

UGX 15,284
UGX 18,32517%
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