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Silicone CPU Thermal Pad High Efficient Thermal Pad 12.8 W 30x30x2.0mm

UGX 26,988
UGX 40,15433%

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Delivery Fees UGX 12,588
Ready for pickup between 18 January and 23 January if you place your order within the next 1hrs 4mins

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Delivery Fees UGX 19,488
Ready for delivery between 18 January and 23 January if you place your order within the next 1hrs 4mins

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Free return within 7 days for eligible items.Details

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Description:

Excellent thermal conductivity: upgraded thermal conductive silicone material with a thermal conductivity of 12.8 W/. Our thermal pad greatly improves the heat transfer between electronic components and effectively cool the temperature in a few seconds.
Used for graphics cards, graphics chips and CPU chips: heat pad can greatly reduce the CPU temperature, solve the heat dissipation problem of most notebook computer.
Super reliable and durable: 40-200-C high temperature performance will not melt, , tasteless, anti-corrosion, wear-resistant, anti-static, flame retardant, compression, insulation. Any contact with electrical traces will not cause any damage.
Easy to use: the thermal pad can be cut freely according to your needs, perfectly filling the between the contact surfaces.
Wide application range: it can perfectly replace the traditional composite rubber and is suitable for control panel, motor, electronic products, CPU, GPU, , power LED, automotive machinery, computer host, notebook computer and any heat dissipation module.

Specification:

Thermal Conductivity: 13.8w/
Density: 3.3 ± 0.1
Hardness: 40-80 (SC)
Working Environment Temperature: - 40-200 ° C

Package Includes:

1 Piece CPU Thermal Pad

Thermal Pad;CPU Thermal Pad High Efficient Thermal Pad;12.8 W Silicone Thermal Pad Heat Sink;Insulated Heat High Temperature Resistant;North And South Thermal Pad;GPU Memory Heat Sink gaming graphics card

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Specifications

Key Features

  • Excellent thermal conductivity: upgraded thermal conductive silicone material with a thermal conductivity of 12.8 W/. Our thermal pad greatly improves the heat transfer between electronic components and effectively cool the temperature in a few seconds.
  • Used for graphics cards, graphics chips and CPU chips: heat pad can greatly reduce the CPU temperature, solve the heat dissipation problem of most notebook computer.
  • Super reliable and durable: 40-200-C high temperature performance will not melt, , tasteless, anti-corrosion, wear-resistant, anti, flame retardant, compression, insulation. Any contact with electrical traces will not cause any damage.
  • Easy to use: the thermal pad can be cut freely according to your needs, perfectly filling the between the contact surfaces.
  • Wide application range: it can perfectly replace the traditional composite rubber and is suitable for control panel, motor, electronic products, CPU, GPU, , power LED, automotive machinery, computer host, notebook computer and any heat dissipation module.

What’s in the box

1 Piece CPU Thermal Pad

Specifications

  • SKU: GE779VP4FHKBVNAFAMZ
  • Model: N/A
  • Production Country: China
  • Size (L x W x H cm): 20.00 x 17.00 x 2.00
  • Weight (kg): 0.14
  • Color: 30x30x2.0mm
  • Main Material: Silicone

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Silicone CPU Thermal Pad High Efficient Thermal Pad 12.8 W 30x30x2.0mm

Silicone CPU Thermal Pad High Efficient Thermal Pad 12.8 W 30x30x2.0mm

UGX 26,988
UGX 40,15433%
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