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SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat

UGX 59,840
UGX 85,48530%

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+ shipping from UGX 12,073 to Central Business District
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Delivery Fees UGX 12,073
Ready for pickup between 09 January and 14 January if you place your order within the next 13hrs 50mins

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Delivery Fees UGX 14,073
Ready for delivery between 09 January and 14 January if you place your order within the next 13hrs 50mins

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Free return within 7 days for eligible items.Details

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Product details

SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat

1. Type: Test Block
2. Working frequency: High frequency
3. Application: Integrated Circuit IC
4. Contact impedance: Less than 25 milliohms
5. Production process: Injection molding
6. Features: Fire retardant/flame retardant
7. Contact material: Beryllium copper shrapnel
8. Insulator material: PEI, PPS
9. Number of cores: 20
10. Working temperature: -65~155 degrees Celsius
11. Lead spacing: 0.65mm
12. Service life: 20,000 times
13. Adaptation chip body width: 4.4mm
Features:
1. Using double contact technology, the contact is more stable
2. The seat shell is made of special engineering plastic, which has high strength and long life.
3. The shrapnel adopts imported beryllium copper material, which has low impedance and good elasticity
4. Thick gold plating layer, thick contact plating, ultra-low contact impedance, high reliability


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Specifications

Key Features

  • SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat
  • SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat
  • SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat
  • SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat
  • SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat

What’s in the box

1 x package

Specifications

  • SKU: GE779EA2LJYE1NAFAMZ
  • Model: B19173NXB=TBD05546855
  • Production Country: China
  • Size (L x W x H cm): 15 x 12 x 6cm
  • Weight (kg): 0.18
  • Color: Multicolor
  • Main Material: Multi-Material

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SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat

SSOP20 TSSOP20 OTS-28-0.65-01 Chip Burning Seat

UGX 59,840
UGX 85,48530%
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