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HomeComputingComputer AccessoriesCables & InterconnectsVGA CablesThermal Compound Heat Sink Thermal Compound CPU Silicone
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UGX 15,756
UGX 22,19129%
In stock
+ shipping from UGX 4,579 to Central Business District
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Delivery Fees UGX 4,579
Ready for pickup between 04 October & 09 October when you order within next 1hrs 35mins
Door Delivery
Delivery Fees UGX 5,679
Ready for delivery between 04 October & 09 October when you order within next 1hrs 35mins
Return Policy
Free return within 7 days for eligible items.Details
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pomegranate
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Quality Score: Excellent
Product details
Solve problems for your blue screen of death; overheated CPU; files loss,etc. Its outstanding performance on the CPU will meet your high standard demand for cooling system.
Features:
Thermal coupling of electric/electronic devices to heat sinks
High conductivity; stable at high temperature
The heat sink compound applies to computer CPU, heat sink, graphics card, optical devices.
Dissspate effectively of CPU or GPU
Easy to apply and avoid voids between CPU and cooler
Specification:
Type: Silicone fluid
Physical form: Grease-like
Item size: 3.5 * 2.8 * 2.8cm / 1.38 * 1.10 * 1.10in(L * W * H)
Item weight: Approx.20g / 0.71oz
Package list:
1 * Thermal Compound
Features:
Thermal coupling of electric/electronic devices to heat sinks
High conductivity; stable at high temperature
The heat sink compound applies to computer CPU, heat sink, graphics card, optical devices.
Dissspate effectively of CPU or GPU
Easy to apply and avoid voids between CPU and cooler
Specification:
Type: Silicone fluid
Physical form: Grease-like
Item size: 3.5 * 2.8 * 2.8cm / 1.38 * 1.10 * 1.10in(L * W * H)
Item weight: Approx.20g / 0.71oz
Package list:
1 * Thermal Compound
Specifications
Key Features
- Thermal coupling of electric/electronic devices to heat sinks
- High conductivity; stable at high temperature
- The heat sink compound applies to computer CPU, heat sink, graphics card, optical devices.
- Dissspate effectively of CPU or GPU
- Easy to apply and avoid voids between CPU and cooler
- Thermal coupling of electric/electronic devices to heat sinks
What’s in the box
1 x Thermal Compound
Specifications
- SKU: GE779EA2MANS6NAFAMZ
- Product Line: Generic
- Model: Thermal Paste
- Production Country: China
- Size (L x W x H cm): 3.50×2.80×2.80
- Weight (kg): 0.03
- Certifications: Fair Trade
- Color: Multi
- Main Material: N/A
- From the Manufacturer: N/A
- Care Label: N/A
- Shop Type: Jumia Mall
- Warranty Address: N/A
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Thermal Compound Heat Sink Thermal Compound CPU Silicone
UGX 15,756
UGX 22,19129%
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