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Universal Mini Mobile Phone Cooling Plate Ic Heat Sink Expend Cooling Area For Game Cooler Cell Phone Cooler

UGX 304,900
UGX 525,68942%

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+ shipping from UGX 59,833 to Central Business District
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Delivery Fees UGX 59,833
Ready for pickup between 11 December & 16 December when you order within next 4hrs 26mins

Door Delivery

Delivery Fees UGX 66,733
Ready for delivery between 11 December & 16 December when you order within next 4hrs 26mins

Return Policy

Free return within 7 days for eligible items.Details

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Ponycot

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Product details

U.S. buyer attention: The areas where the US warehouse does not deliver goods are: Hawaii, Alaska, Puerto Rico, Guam and other US oas territories. And the military addre.

Spanish buyers attention: if your addre includes following postal code please do not choose the Spanish warehouse. The z code starts with 51/52/07/35/38/28. Oas warehouse cannot be delivered.

Ordinary/ic Semiconductor Mobile Phone Cooling Plate Heat Sink Expend for Cooling Fans Gaming Cell Phone Cooler Stickers for PUBG Mobile Feature: Semiconductor refrigeration + large area heat sink. For the hot spots of mobile phones, a large-area soaking plate is used to quickly neutralize the heat to achieve uniform heat diation. Easy to take and stick, comes with silicone protection, soft, does not hurt the phone, does not scratch the hand Strong . No shedding of strong adhesive, firm adsorption, not afr of the falling Give you a thin and light experience, the thickne is only 1mm, closely fit the mobile phone, thin and light experience ic suction type/back cl semiconductor type heat sink is suitable. Closely fit the mobile phone, seamle conduction of cold in all directions Specification: Product name: Composite soaking plate Product style: ordinary model-back thermal silica , ic suction model-back water-washed glue, ic suction upgraded model-back-washed glue+thermal conductive silica (optional) Product color: Black Product material: Aluminum sheet + silicone of application: Mobile phone semiconductor Product size: 60x106x1mm/2.36x4.17x0.04in Packing size: 66x111x2mm/2.6x4.37x0.08in Product weight: 18g Product style: Ordinary model - thermal conductive silica on the back (used with the back cl type semiconductor , the back is made of conductive silicon paper, which can be removed and reused) ic model - back wash glue / ic upgrade - back wash glue + thermal silica Instructions: It is attached to the back of the mobile phone and used with a semiconductor to increase the heat diation area and extend to the mobile phone CPU and camera to cool down. The ic suction product is embedded with a ic sheet, which is seamlely d, and the ic suction can be directly adsorbed and used. Note: Some mobile phones are not applicable. Before purchasing, please confirm whether the next model can be used. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the tures. Thank you! Please allow 1-2cm measuring deviation due to manual measurement.

1x Composite izer

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About shping
Shping and Pack All it will be double checked and well packed before sending.It will be dispatched within 2 business days after buyers pay for the order. It usually takes about 14 to 18 working days for delivering the package to the destination(for e areas,it may take a little longer). 

Special Announcement:
Please fill in the correct and detailed consignee, address and phone number in the order. For fast and correct delivery.If you do not receive order within 30 working days,please feel free to contact Customer Service before leaving Negative and Neutral Feedback, we will do our best to help you resoe the problem.TaxNo, you will only pay what is quoted as total cost at checkout, no more. You are not expected to pay any additional duties or taxes. If you are asked by Customs or our logistic partner to pay duties, please contact our Customer Service .

Your 100% satisfaction is very ant to us
If the product is not on good condition, You can return this product within 14 working days, please contact customer service center before returning.FeedbackYour satisfaction is our first priorityIf you receive the order and it is in good condition,we would be grateful if you would leave us 5 star Positive Feedback for the transaction.

Specifications

What’s in the box

1X Universal Mini Mobile Phone Cooling Plate Magnetic Heat Sink Expend Cooling Area for Game Cooler Cell Phone Cooler

Specifications

  • SKU: GE779VP48WT8ENAFAMZ
  • Model: 2PONshoujifengshan2739
  • Production Country: China
  • Size (L x W x H cm): 10x8x6
  • Weight (kg): 0.3
  • Color: Magnetic

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Universal Mini Mobile Phone Cooling Plate Ic Heat Sink Expend Cooling Area For Game Cooler Cell Phone Cooler

Universal Mini Mobile Phone Cooling Plate Ic Heat Sink Expend Cooling Area For Game Cooler Cell Phone Cooler

UGX 304,900
UGX 525,68942%
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