This website uses cookies
This website uses cookies. For further information on how we use cookies you can read our Privacy and Cookie notice
This website uses cookies. For further information on how we use cookies you can read our Privacy and Cookie notice
Shipped from abroad
Free return within 7 days for eligible items.Details
Ponycot
98%Seller Score
6 Followers
Shipping speed: Excellent
Feature:
[Mobile phone composite even heat plate] fast cooling uniform heat diation, increase the heat diation area, accelerate the speed of heat diation. [Semiconductor cooling & large area heat sink] for cell phone using a large area even heat sink, rapid neutralization of heat to achieve uniform heat diation effect. [Strong adhesive - not fall off] strong adhesive, firmly adsorbed, no need to worry about fall. [Thin and light experience] The thickne is only 1mm, closely fit the phone. [With silicone protection, do not hurt the phone] easy to take and easy to , with silicone protection, soft and do not hurt the hine.
Product Specifications.
Product name: Composite uniform heat plate Product category: ordinary models (need with semiconductor cooling back cl use, back material conductive silicon paper) ic (universal ic models and back cl models heat sink use, the back of the material double-sided adhesive) How to use: Attach to the back of the phone, with the use of heat sink, increase the heat diation area, to achieve the phone CPU and camera cooling. The ic absorbing product is embedded inside the ic sheet, seamlely d, the ic absorbing can be directly adsorbed to use.
Package Included:
1×Heat sink area increase plate
About shpingThis product has no ratings yet.